When advanced packaging demands finer features, aerosol printing delivers sub-10 µm conductive traces.
Achieving this level of resolution is made possible by the NanoJet’s best-in-class particle focusing capabilities and precise aerosol control, enabling ultra-fine, high-aspect-ratio features in a non-contact, room-temperature process. Capabilities like this are opening new opportunities for advanced packaging, high-density interconnects, and next-generation microelectronic integration.
Want to see how this technology can support advanced packaging applications? Join Stephen Barnes tomorrow at the Flex Technology Summit in Phoenix, where he’ll present on this ultra-fine printing capability and how aerosol printing is being leveraged for advanced packaging solutions.
If you can’t attend, reach out to learn more about how NanoJet aerosol printing can support your application.
