Applications
AR/VR/MR Devices
- High Refractive Index Matching Material Printing
- High-precision edge-coating with adjustable deposit geometries
- Fresnel lens feature coating
- Smart Contact Lenses
- Conductive traces
- High-precision coatings & encapsulation
- Electronics Miniaturization
- Light-weight printed conductors
- Micro-batteries
materials for extreme environments
The wide range of materials available with aerosol printing enable applications with extreme environmental requirements. Potential application areas include aerospace, defense, and material science research.
- Platinum
- Gold
- Barium Strontium Titanate (BST)
- Ceramics
- Alumina Surfaces
- Graphene
- Polyimide
polyimide / aluminum
biomedical
The NanoJet technology can be used for a variety of biomedical applications. Circuits have been printed onto flexible substrates such as liquid crystal polymer (LCP), polyimide and polyethylene terephthalate (PET). Printed circuits are flexible and can be encapsulated using biocompatible encapsulants such as PDMS or Parylene. The NanoJet technology can be used to print sensors using silver, platinum, and gold nanoparticle inks.
- Temperature Sensitive Substrates
- Deposition of low-temperature curing polymeric and conductive materials
- Multi-Material Printing
- Layered printing of multiple materials for heaters, thin-film transistors, and conductor encapsulation
- High-Precision Biocompatible Printing
- <50 µm deposition of gold, platinum, and biocompatible polymers
Passive electronic components
- Capacitors
- Resistors
- Inductors
- Interconnects
microbumps
- Recent developments have proven the capability to utilize the NanoJet systems to produce ultra-fine dots of materials. Through the use of a well-controlled pneumatic shutter system, IDS aerosol print systems focus the aerosol flow into a small packet of material and can deposit dots with diameters less than 10 microns.
- For fragile substrates, rapid prototyping, and novel deposition profiles
advanced packaging
- Vertical interconnect printing
- Wire bond replacements in high-frequency and non-planar applications
- Edge Printing
- High-precision printing over corners for microelectronic fabrication and circuit repair to increase yield
heaters & strain gauges
- Printing heaters and strain gauges onto existing components
- Miniaturization for reduced SWaP-C
- Printing onto complex and curved surfaces
circuit repair
- Restoration of high-value legacy circuit boards
- Manufacturing yield improvement of flat panel displays
- Laser sintering enables low temperature processing
micro-coatings
- Fluid/environmental sealing
- Assembly adhesives
- High-precision protective layering
- Biomedical coatings
micro-
Adhesives
- Polymeric Adhesive Dispensing
- Wafer-bonding applications
- Customizable deposition geometries (no longer limited to dots)
- Conductive Adhesive Dispensing
- Printing of conductive adhesives (silver epoxy) into recesses such as through silicon vias (TSV)
antennas &
emi shielding
- Non-contact printing of complex algorithm-generated design patterns
- Enables multi-axis printing onto 3D surfaces
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